Semiconductor device

ABSTRACT

A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No.PCT/JP2013/004614, filed on Jul. 30, 2013, and is based on and claimspriority to Japanese Patent Application No. JP 2012-253403, filed onNov. 19, 2012. The disclosure of the Japanese priority application andthe PCT application in their entirety, including the drawings, claims,and the specification thereof, are incorporated herein by reference.

BACKGROUND

1. Field

Embodiments of the present invention provide a semiconductor device,such as a power device or a high-frequency switching integrated circuit(IC), in which an insulating substrate having a semiconductor chipmounted thereon is provided in an opening region formed in a frame bodyand a lead portion formed in the frame body is connected to thesemiconductor chip by a bonding wire.

2. Discussion of the Background

In general, in a power device, such as a power conversion inverterdevice, or a high-frequency switching IC, an insulating substrate onwhich a semiconductor chip having an insulated gate bipolar transistor(IGBT) or a power metal-oxide-semiconductor field-effect transistor(MOSFET) as a switching element or a semiconductor chip, such as afree-wheeling diode (FWD), is mounted is provided in an opening regionformed in a frame body.

An electronic device disclosed in Japanese Publication JP 2005-353742 Ahas been proposed as the semiconductor device. In the electronic devicedisclosed in Japanese Publication JP 2005-353742 A, a control unit and adriving unit which form the electronic device are mounted on a mountingsurface of an island portion of a lead frame. The control unit and thedriving unit are electrically connected to first and second leadportions of the lead frame through bonding wires, respectively. Thecontrol unit, the driving unit, each bonding wire, the island portion,and the first and second lead portions are sealed by a molding resin.Here, each of the first and second lead portions includes a rectangularpad portion to which the bonding wire is bonded and an elongatedexternal connection portion which is connected to the rectangular padportion.

In Japanese Publication JP 2006-147908 A, an inner lead frame which issupported by an insulating material is provided in an external leadframe supported by a supporting member, and a semiconductor chip ismounted on the inner lead frame and is connected to the inner frame andan external frame by a bonding wire. Here, the external frame includes acircular portion for bonding the bonding wire and a lead portion whichis connected to the circular portion.

SUMMARY

However, in the device according to the related art disclosed inJapanese Publication JP 2005-353742 A, the lead portion is arranged suchthat a predetermined space is formed between the inner end thereof andthe island portion. Therefore, there is an unsolved problem that thesize of the overall structure is increased by a value corresponding tothe predetermined space, and it is difficult to respond to a demand forminiaturization. In addition, in the device according to the related artdisclosed in Japanese Publication JP 2006-147908 A, similarly to thedevice disclosed in Japanese Publication JP 2005-353742 A, the externallead frame is arranged such that a predetermined space is formed betweenthe inner end thereof and the external end of the inner lead frame.Therefore, there is an unsolved problem that the size of the overallstructure is increased by a value corresponding to the predeterminedspace, and it is difficult to respond to a demand for miniaturization.Embodiments of the invention provide a semiconductor device which can beminiaturized.

According to a first aspect of the invention, a semiconductor deviceincludes a frame body having an opening region formed in a centralportion, an insulating substrate which is provided in the opening regionof the frame body and on which a semiconductor chip is mounted, a leadportion including an inclined portion that is at least partially exposedto the opening region formed in the frame body and extends so as to beinclined with respect to an end surface forming the opening region, anda bonding wire that is bonded between the lead portion and thesemiconductor chip by ultrasonic bonding.

According to a second aspect of the invention, in the semiconductordevice, the inclined portion may extend in a direction in which avibration component is suppressed during the ultrasonic bonding of thebonding wire. According to a third aspect of the invention, in thesemiconductor device, the lead portion may include a movementrestriction portion that is formed on a side opposite to the openingregion and restricts the movement of the lead portion to the outside ofthe frame body. The frame body may include a receiving portion that isfitted to the movement restriction portion.

According to a fourth aspect of the invention, in the semiconductordevice, the lead portion may include a parallelogram region havinginclined end surfaces that intersect the end surface forming the openingregion and are parallel to each other and a terminal portion thatprotrudes and extends from one side of the parallelogram region which isopposite to the opening region to the outside of the frame body.According to a fifth aspect of the invention, in the semiconductordevice, the lead portion may include: an inclined portion including aninclined end surface that extends from the end surface forming theopening region and intersects the end surface and an orthogonal endsurface that is perpendicular to the end surface; and a step portionthat is formed on a side of the orthogonal end surface opposite to theopening region and restricts the movement of the lead portion to theoutside of the frame body.

According to a sixth aspect of the invention, in the semiconductordevice, in the lead portion, at least one side which intersects the endsurface forming the opening region may be formed in a dogleg endsurface, thereby forming the inclined portion. According to a seventhaspect of the invention, in the semiconductor device, in the leadportion, one of two sides which intersect the end surface forming theopening region may be formed in a dogleg end surface and the other sidemay be formed in an end surface perpendicular to the end surface,thereby forming the inclined portion.

According to an eighth aspect of the invention, in the semiconductordevice, in the lead portion, two sides which intersect the end surfaceforming the opening region may be formed in dogleg end surfaces that arecurved in the same direction, thereby forming the inclined portion.According to a ninth aspect of the invention, in the semiconductordevice, in the lead portion, two sides which intersect the end surfaceforming the opening region may be formed in curved end surfaces that arecurved in the same direction, thereby forming the inclined portion.According to a tenth aspect of the invention, in the semiconductordevice, in the lead portion, the inclined portion may be a bonding wirebonding portion.

According to an eleventh aspect of the invention, a semiconductor deviceincludes a frame body having an opening region formed in a centralportion, an insulating substrate which is provided in the opening regionof the frame body and on which a semiconductor chip is mounted, a leadportion including a plate portion that is at least partially exposed tothe opening region formed in the frame body and extends in a directionin which the plate portion intersects an end surface forming the openingregion and an uneven portion that is formed on at least one side of theplate portion, and a bonding wire that is bonded between the leadportion and the semiconductor chip by ultrasonic bonding. According to atwelfth aspect of the invention, in the semiconductor device, the unevenportion may extend in a direction in which a vibration component issuppressed during the ultrasonic bonding of the bonding wire.

According to embodiments of the invention, when vibration is applied toa lead portion at the time the lead portion and a semiconductor chip areconnected to each other by ultrasonic bonding using a bonding wire, itis possible to suppress a vibration component in the direction in whichan inclined portion or a concave portion extends. Even when the leadportion is exposed to an opening region, it is possible to performultrasonic bonding with high accuracy. Therefore, the lead portion canbe formed so as to lean to the inside, as compared to when the inner endof the lead portion is arranged at a position that is away from theopening region to the outside so as not to be affected by the influenceof vibration during ultrasonic bonding. As a result, it is possible toreduce the size of the overall structure.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view illustrating a semiconductor device according to afirst embodiment of the invention, in which a portion of thesemiconductor device is not illustrated.

FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1.

FIG. 3 is a plan view illustrating a semiconductor device according to asecond embodiment of the invention, in which a portion of thesemiconductor device is not illustrated.

FIG. 4 is a cross-sectional view taken along the line B-B of FIG. 1.

FIGS. 5A, 5B, 5C, and 5D are diagrams illustrating modifications of alead portion.

FIGS. 6A, 6B, 6C, 6D, 6E, and 6F are diagrams illustrating modificationsof the lead portion.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

Hereinafter, embodiments of the invention will be described withreference to the drawings. FIG. 1 is a plan view illustrating asemiconductor device according to a first embodiment of the invention,in which a portion of the semiconductor device is not illustrated, andFIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1. Asemiconductor device 1 has, for example, a rectangular shape in a planview and includes a frame body 3 which is made of, for example, asynthetic resin and has a rectangular opening region 2 formed at thecenter and an insulating substrate 4 which is made of, for example,electrical and/or heat insulating materials, such as ceramic, aluminum,etc., and is provided in the opening region 2 of the frame body 3.

In the frame body 3, a plurality of lead portions, for example, fourlead portions 5 a to 5 d with a thickness of about 0.3 mm to 0.6 mm areprovided in accommodation grooves 6 a to 6 d, respectively, which have ashape corresponding to the shape of the lead portion, so as to beexposed to the opening region 2. Here, the lead portion 5 a includes anopening end surface 5 a 1 which is exposed to the opening region 2, aninclined end surface 5 a 2 which is inclined and extends in the lowerright direction of FIG. 1 at an inclination angle α of, for example, 45degrees with respect to an end surface 2 a forming the opening region 2,an orthogonal end surface 5 a 3 which extends vertically to the endsurface 2 a formed on the left side of the inclined end surface 5 a 2, aplurality of step portions 5 a 4 which are formed at the outer end ofthe orthogonal end surface 5 a 3, and a thin external connectionterminal portion 5 a 5 which is connected to the final step portionamong the step portions 5 a 4 and the outer end of the inclined endsurface 5 a 2. A region which is surrounded by the opening end surface 5a 1, the inclined end surface 5 a 2, the orthogonal end surface 5 a 3,and the step portions 5 a 4 is an inclined portion 5 a 6.

The lead portions 5 b to 5 c have the same structure as the lead portion5 a except that the orthogonal end surface 5 a 3 of the lead portion 5 ais omitted and a parallelogram is formed by inclined end surfaces 5 b 3to 5 d 3 parallel to inclined end surfaces 5 b 2 to 5 d 2, respectively,instead of the orthogonal end surface 5 a 3. However, for the leadportion 5 d, the inclination angle of the inclined end surfaces 5 d 2and 5 d 3 is set to about 60 degrees with respect to the end surface 2 ain the lower right direction of FIG. 1.

The lead portion 5 d has the same shape as the lead portions 5 b and 5 cexcept for the number of step portions 5 d 4. For example, the number ofstep portions 5 b 4 or 5 c 4 is two or more, and the number of stepportions 5 d 4 is one.

In addition to the lead portions 5 a to 5 d, three lead portions 7 a to7 c are formed in the frame body 3.

The lead portions 5 a to 5 d are respectively arranged in theaccommodation grooves 6 a to 6 d formed in the frame body 3 so as not tocome off to the opening region 2.

A predetermined number of semiconductor chips 8, each having a switchingelement, such as an insulated gate bipolar transistor (IGBT) or a powerMOSFET, and a predetermined number of semiconductor chips 9, each havinga free-wheeling diode (FWD) that is connected in inverse parallel to theswitching element of the semiconductor chip 8, are provided in parallelon the insulating substrate 4. The semiconductor chips 8 and 9, and thelead portions 5 a to 5 d and 7 a to 7 c are electrically bonded to eachother by bonding wires 10. For the lead portions 5 a to 5 d, theinclined portions 5 a 6 to 5 d 6 are used as pads for ultrasonic bondingusing the bonding wires 10. The bonding wire 10 is bonded by anultrasonic welder. The head of the ultrasonic welder comes into contactwith the lead portions 5 a to 5 d and vibrates in a directionperpendicular to the end surface 2 a, that is, the front-rear directionin the plan view of FIG. 1 to perform welding.

In the ultrasonic bonding, when a vibration force in the front-reardirection is transmitted to each of the lead portions 5 a to 5 d, thelead portions 5 a to 5 d may be separated from the grooves 6 a to 6 dand move into the opening region 2. However, the inclined end surface 5a 2 of the lead portion 5 a is inclined at an angle of 45 degrees in thelower right direction and the lead portions 5 a to 5 d each include thestep portion 5 a 4 serving as a movement restriction portion forrestricting the movement of the lead portions 5 a to 5 d to the outsideof the frame body 3. Therefore, component force in a direction in whichthe inclined portion 5 a 6 comes off to the opening region 2 due to thevibration force of the ultrasonic welder in the front-rear direction isreduced, and it is possible to reliably prevent the lead portion 5 afrom coming off to the opening region 2 due to the vibration forceduring ultrasonic bonding.

For the lead portions 5 b to 5 d, the inclined portions 5 b 6 to 5 d 6have a parallelogram shape formed by the respective inclined endsurfaces 5 b 2 to 5 d 2 and 5 b 3 to 5 d 3 which are inclined in thelower right direction. Therefore, similarly to the lead portion 5 a, itis possible to reliably prevent the inclined portions 5 b 6 to 5 d 6from coming off to the opening region 2 due to the vibration force ofthe ultrasonic welder in the front-rear direction. In addition, evenwhen the lead portions 5 a to 5 d have a relatively small thickness of0.3 mm to 0.6 mm, they do not vibrate during ultrasonic bonding, and itis possible to stably perform bonding. Since the inclined end surfaces 5a 2 to 5 c 2, 5 b 3, and 5 c 3 of the lead portions 5 a to 5 c areinclined in the same direction, adjacent lead portions 5 a to 5 c can bearranged at equal intervals.

Therefore, it is possible to reduce the gap between adjacent leadportions 5 a to 5 c and thus to reduce the size of the overallstructure. As such, in the first embodiment, the lead portions 5 a to 5d can be formed at a position close to the opening region 2 so as tohave the opening end surfaces 5 a 1 to 5 d 1 exposed to the openingregion 2. Therefore, it is not necessary to form a space region betweenthe lead portion and the opening region 2, unlike the related art. As aresult, it is possible to reduce the size of the overall structure by avalue corresponding to the space region.

In the first embodiment, the inclination angle of the inclined endsurface forming the inclined portions 5 a 6 to 5 d 6 is set to 45degrees or 60 degrees in the lower right direction (clockwisedirection). However, the invention is not limited thereto. Theinclination angle may be set to any value in the range of 10 degrees to80 degrees in the lower right direction (clockwise direction). In thiscase, when the inclination angle is less than 10 degrees, the gapbetween adjacent lead portions is small and it is difficult to ensurethe width of the lead portion. When the inclination angle is greaterthan 80 degrees, force to restrict movement due to the vibration forceduring ultrasonic bonding is reduced and it is difficult to performstable ultrasonic bonding. In addition, the inclination angle α of theinclined end surface of each of the lead portions 5 a to 5 d may beinclined in the lower left direction (counterclockwise direction),instead of being inclined to the lower right direction (clockwisedirection).

Next, a second embodiment of the invention will be described withreference to FIG. 3. In the second embodiment, the shape of an inclinedportion of each of lead portions 5 a to 5 d is changed. That is, in thesecond embodiment, as illustrated in FIG. 3, one of the end surfaces ofeach of five lead portions 15 a to 15 e which intersect an end surface 2a forming an opening region 2 is formed into dogleg end surfaces 15 a 2to 15 e 2, respectively.

The left side of the lead portion 15 a includes an end surface 15 a 2having two dogleg shapes formed by an orthogonal end surface portion 15a 21 which is perpendicular to the end surface 2 a at a position exposedto the end surface 2 a, an inclined end surface portion 15 a 22 which isinclined from the rear end of the orthogonal end surface portion 15 a 21in the front right direction, and an orthogonal end surface portion 15 a23 which extends forward from the leading end of the inclined endsurface portion 15 a 22. The other side of the lead portion 15 a is anorthogonal end surface 15 a 3 which is perpendicular to the end surface2 a. A region which is surrounded by the dogleg end surface 15 a 2, theorthogonal end surface 15 a 3, and the opening end surface 15 a 1 is aninclined portion 15 a 4 having an inclined end surface. In addition, astep portion 15 a 5 which is parallel to the opening end surface 15 a 1is formed from the leading end of the dogleg end surface 15 a 2. A stepportion 15 a 7 which is parallel to the opening end surface 15 a 1 isformed from the leading end of the orthogonal end surface 15 a 3. Anexternal connection terminal portion 15 a 6 is formed at the leadingends of the step portion 15 a 5 and the step portion 15 a 7. The stepportion 15 a 5 can suppress the movement of the lead portion 15 a to theopening region 2 due to vibration which is generated during theultrasonic bonding of bonding wires and is applied to the lead portion15 a in the front-rear direction. The step portion 15 a 7 can suppressthe movement of the lead portion 15 a to the outside of a frame body 3.

On one side of each of the lead portions 15 b to 15 d which isperpendicular to the end surface 2 a forming the opening region 2, acentral portion in the front-rear direction protrudes toward the outsideand dogleg end surfaces 15 b 2 to 15 d 2 are formed, as compared to thelead portion 15 a. Regions which are surrounded by the dogleg endsurfaces 15 b 2 to 15 d 2, the orthogonal end surfaces 15 b 3 to 15 d 3,and the opening end surfaces 15 b 1 to 15 d 1 are inclined portions 15 b4 to 15 d 4 having inclined end surfaces, respectively. In addition,step portions 15 b 5 to 15 d 5 are formed at the leading ends of thedogleg end surfaces 15 b 2 to 15 d 2, respectively. External connectionterminal portions 15 b 6 to 15 d 6 are formed at the right ends of thestep portions 15 b 5 to 15 d 5 and on the extension lines of theorthogonal end surfaces 15 b 3 to 15 d 3. The step portions 15 b 5 to 15d 5 can restrict the movement of the lead portions 15 b to 15 d to theoutside of the frame body 3, respectively.

The lead portion 15 e includes an inclined end surface 15 e 3 includingan orthogonal end surface 15 e 31 which is provided at the positionwhere the orthogonal ends 15 b 3 to 15 d 3 of the lead portions 15 b to15 d are exposed to the end surface 2 a, an inclined end surface 15 e 32which extends from the leading end of the orthogonal end surface 15 e 31to the front left side, and an orthogonal end surface 15 e 33 whichextends forward from the leading end of the inclined end surface 15 e 32in parallel to the orthogonal end surface 15 e 31. A region which issurrounded by the inclined end surface 15 e 3, the dogleg end surface 15e 2, and the opening end surface 15 e 1 is an inclined portion 15 e 4having an inclined end surface. In addition, a step portion 15 e 5 isformed at the leading end of the inclined end surface 15 e 3. Anexternal connection terminal portion 15 e 6 is formed so as to extendforward from the left end of the step portion 15 e 5 and the leading endsurface of the dogleg end surface 15 e 2.

As illustrated in the enlarged view of the lead portion 15 e in FIG. 3,an R-chamfered portion 15 f is formed at the apex of the central portionof each of the dogleg end surfaces 15 b 2 to 15 e 2 of the lead portions15 b to 15 e. As such, when the R-chamfered portion 15 f is formed, itis possible to prevent discharge between adjacent lead portions. Inaddition, it is easy for a resin sealing material 11 to flow into a moldduring resin molding and it is possible to prevent the insufficientfilling of the molding resin in, for example, a short mold.

The lead portions 15 a to 15 e are accommodated in accommodation grooves16 a to 16 e formed in the frame body 3, respectively. The otherstructures are the same as those in the first embodiment. Therefore,components corresponding to those illustrated in FIG. 1 are denoted bythe same reference numerals and the detailed description thereof willnot be repeated. According to the second embodiment, the dogleg endsurfaces 15 a 2 to 15 e 2 are formed in the lead portions 15 a to 15 e,respectively. Therefore, the dogleg end surfaces 15 a 2 to 15 e 2 canreliably prevent the movement of the lead portions 15 a to 15 e in thefront-rear direction during ultrasonic bonding. As a result, it ispossible to obtain the same operation and effect as those in the firstembodiment.

In the first and second embodiments, the inclined portion includes theinclined end surface or the dogleg end surface. However, the inventionis not limited to the above-mentioned structure. As illustrated in FIGS.5A-D and 6A-F, the inclined portion may have various shapes. That is, asillustrated in FIG. 5A, a pair of dogleg end surfaces 25 a and 25 bwhich protrude in the same direction may be provided to form an inclinedportion 25 c, and a step portion 25 d may be formed.

As illustrated in FIG. 5B, a dogleg inclined portion 26 e may be formedby relatively short orthogonal end surfaces 26 a and 26 b which areexposed to the end surface 2 a forming the opening region 2 and areperpendicular to the end surface 2 a and inclined end surfaces 26 c and26 d which obliquely extend from the leading ends of the orthogonal endsurfaces 26 a and 26 b to the front right side, respectively, and a stepportion 26 f may be formed.

As illustrated in FIG. 5C, a curved inclined portion 27 c may be formedby a pair of curved end surfaces 27 a and 27 b which swell to the leftside. In addition, as illustrated in FIG. 5D, an S-shaped inclinedportion 27 f may be formed by the curved end surfaces 27 a and 27 b andcurved end surfaces 27 d and 27 e which are curved in a directionopposite to the direction in which the curved end surfaces 27 a and 27 bare curved. Here, for the inclined portions 27 c and 27 f illustrated inFIGS. 5C and 5D, the curved end surfaces 27 a and 27 b or 27 d and 27 emay be inclined along a surface which is inclined with respect to theend surface 2 a, and a step portion 27 h may be formed. In FIGS. 5A-D,since the lead portions protrude or are curved in the same direction,adjacent lead portions can be arranged at equal intervals. Therefore, itis possible to reduce the gap between adjacent lead portions and thusreduce the size of the overall structure.

The shape of the lead portions which protrude or are curved in the samedirection makes it possible to reduce component force in the directionin which the lead portion comes off to the end surface 2 a forming theopening region 2 due to vibration force during the ultrasonic bonding ofbonding wires. Therefore, it is possible to prevent the lead portionfrom coming off to the end surface 2 a. In addition, since the stepportions 25 d, 26 f, and 27 h are formed, it is possible to prevent themovement of the lead portions to the outside of the frame body 3 due tovibration force during the ultrasonic bonding of the bonding wires.

In the above-described embodiments, the overall shape of the leadportion forming the inclined portion is a dogleg shape or a curvedshape. However, the invention is not limited thereto. For example, asillustrated in FIGS. 6A-F, a rectangular plate portion 30 which extendsforward from the end surface 2 a of the opening region 2 in a directionperpendicular to the end surface 2 a may be formed and uneven portionsor curved portions may be formed on the left and right sides of therectangular plate portion 30. That is, as illustrated in FIG. 6A, unevenportions 31 with a triangular wave shape may be formed on the left andright sides of the rectangular plate portion 30. Alternatively, asillustrated in FIG. 6B, uneven portions 32 with a square wave shape inwhich phases are inverted in the left-right direction may be formed onthe left and right sides of the rectangular plate portion 30. In thiscase, it is possible to reduce component force in the direction in whichthe lead portion comes off to the end surface 2 a forming the openingregion 2 due to vibration force during the ultrasonic bonding of thebonding wires. Therefore, it is possible to prevent the lead portionfrom coming off to the end surface 2 a.

As illustrated in FIG. 6C, curved portions 33 with a sine wave shape maybe formed in the same phase on the left and right sides of therectangular plate portion 30. Alternatively, as illustrated in FIG. 6D,curved portions 34 with a sine wave shape which has a smaller cycle thanthat illustrated in FIG. 6C may be symmetrically formed on the left andright sides. As illustrated in FIG. 6E, uneven portions 35 and 36 with asawtooth shape may be formed on the left or right side of therectangular plate portions 30. Here, in the sawtooth-shaped unevenportion 35, an inclined extension portion 35 a which obliquely extendsfrom the end surface 2 a to the antero-medial side and a step portion 35b which extends from the leading end of the inclined extension portion35 a to the outside are continuously formed. The sawtooth-shaped unevenportion 36 and the sawtooth-shaped uneven portion 35 are symmetric withrespect to the vertical direction. In this case, as illustrated in FIG.6E, for the sawtooth-shaped uneven portions 35 and 36, thesawtooth-shaped uneven portions 35 and 36 of adjacent lead portions maybe arranged so as not to face each other. Alternatively, thesawtooth-shaped uneven portions 35 and 36 of adjacent lead portions maybe arranged so as to face each other, which is not illustrated.Furthermore, as illustrated in FIG. 6F, the sawtooth-shaped unevenportions 35 illustrated in FIG. 6E may be formed on the left and rightsides. In FIGS. 6E and 6F, since the step portion 35 b and the stepportion 36 b are formed, it is possible to reduce component force in thedirection in which the lead portion comes off to the end surface 2 aforming the opening region 2 due to vibration force during theultrasonic bonding of the bonding wires. Therefore, it is possible toprevent the lead portion from coming off to the end surface 2 a.

In FIGS. 6A, 6B, 6C, and 6F, since the lead portions include the unevenportions 31, 32, 33, and 35 which are inclined or curved in the samedirection, adjacent lead portions can be arranged at equal intervals.Therefore, it is possible to reduce the gap between adjacent leadportions and thus reduce the size of the overall structure. In FIGS.6A-F, the uneven portions 31 to 36 are continuously formed in thefront-rear direction. However, the invention is not limited thereto. Astraight portion or an uneven portion with a different shape may beformed in the middle of the uneven portion. In FIGS. 6A-F, each of theuneven portions 31 to 36 is formed on the side of the rectangular plateportion 30. However, each of the uneven portions 31 to 36 may be formedin a plate portion which obliquely extends in a direction thatintersects the end surface 2 a of the opening region 2, instead of therectangular plate portion 30.

The inclined portion can be formed in any shape as long as it cansuppress the movement of the lead portion into the opening region 2 dueto vibration in the front-rear direction when the bonding wires arebonded by the ultrasonic welder. The R-chamfered portion 15 f of thedogleg end surface in the second embodiment can be applied to each ofthe corners of the lead portions 5 a to 5 d and 15 a to 15 e in thefirst and second embodiments.

Embodiments of the invention can be applied to a semiconductor devicethat is used for any device, such as a power conversion inverter deviceor a high-frequency switching IC.

The invention claimed is:
 1. A semiconductor device comprising: a framebody having an opening region; an insulating substrate disposed in theopening region of the frame body and including a semiconductor chip; alead portion including an inclined portion that is at least partiallyexposed to the opening region of the frame body and that extends so asto be inclined with respect to an end surface forming the openingregion, and a terminal portion that extends outside of the frame body;and an ultrasonic-bonded wire connecting the lead portion and thesemiconductor chip, the inclined portion of the lead portion being a padfor the ultrasonic-bonded wire, and the inclined portion of the leadportion having a width that exceeds a width of the terminal portion ofthe lead portion.
 2. The semiconductor device according to claim 1,wherein the inclined portion extends in a direction in which a vibrationcomponent is suppressed during ultrasonic bonding of theultrasonic-bonded wire.
 3. The semiconductor device according to claim1, wherein the lead portion includes a movement restriction portionformed on a side opposite to the opening region and configured torestrict the movement of the lead portion to the outside of the framebody, and the frame body includes a receiving portion fitted to themovement restriction portion.
 4. The semiconductor device according toclaim 1, wherein the lead portion includes: a parallelogram regionhaving inclined end surfaces that intersect the end surface forming theopening region and are parallel to each other; and the terminal portionthat protrudes and extends from one side of the parallelogram region,which is opposite to the opening region, to the outside of the framebody.
 5. The semiconductor device according to claim 1, wherein the leadportion includes: an inclined portion including an inclined end surfacethat extends from the end surface forming the opening region andintersects the end surface and an orthogonal end surface that isperpendicular to the end surface; and a step portion formed on a side ofthe orthogonal end surface opposite to the opening region and configuredto restrict the movement of the lead portion to the outside of the framebody.
 6. The semiconductor device according to claim 1, wherein, in thelead portion, at least one side which intersects the end surface formingthe opening region is formed in a dogleg end surface, thereby formingthe inclined portion.
 7. The semiconductor device according to claim 1,wherein, in the lead portion, one of two sides which intersect the endsurface forming the opening region is formed in a dogleg end surface andthe other side of the two sides is formed in an end surfaceperpendicular to the end surface forming the opening region, therebyforming the inclined portion.
 8. The semiconductor device according toclaim 1, wherein, in the lead portion, two sides which intersect the endsurface forming the opening region are formed in dogleg end surfacesthat are curved in the same direction, thereby forming the inclinedportion.
 9. The semiconductor device according to claim 1, wherein, inthe lead portion, two sides which intersect the end surface forming theopening region are formed in curved end surfaces that are curved in thesame direction, thereby forming the inclined portion.
 10. Thesemiconductor device according to claim 1, wherein, in the lead portion,the inclined portion is a bonding wire bonding portion.
 11. Thesemiconductor device according to claim 1, wherein the lead portionincludes a first portion extending parallel to an extending direction ofthe end surface forming the opening region and a second portionextending from the first portion in a direction perpendicular to theextending direction of the end surface forming the opening region, andwherein the frame body includes a groove accommodating the lead portion.12. The semiconductor device according to claim 11, wherein an uppersurface of the lead portion is coplanar with an upper surface of theframe body.
 13. The semiconductor device according to claim 1, whereinthe lead portion includes a plurality of lead portions, each of the leadportions including the inclined portion with the same inclined angle,and the plurality of lead portions are arranged so that the inclinedportions are parallel to each other.